Digi Times17h
Samsung, TSMC diverge on panel materials for advanced packaging
Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ.
‘I would definitely do this’: Customer orders foam blocks from Walmart. Then she opens the box
A recent Walmart order left one customer baffled when she received a package of foam blocks in an oversized box stuffed with an unnecessary amount of packaging. Recently, TikTok user cm ...